ACIDHOOD1 |
Small Acid Chemical Hood |
Air Control Acid Hood |
For acid chemical processing |
ACIDHOOD2 |
Large ADA Acid Chemical Hood |
Air Control Acid Hood |
For acid chemical processing |
ALDE1 |
Plasma-Enhanced Atomic Layer Deposition (PE-ALD) System |
Kurt Lesker ALD-150LX |
Plasma-Enhanced Atomic Layer Deposition (PE-ALD) |
ARRAY1 |
Liquid Array Printer |
Scienion S11 sciFlexarrayer |
Liquid Array Printing |
ASH1 |
Plasma Asher |
Emitech K-1050X |
O2 / Ar plasma ashing of photoresist and other organic materials |
BIOHOOD1 |
Biological Hood |
Biological Hood |
Biological Hood |
BIOHOOD2 |
Biological Hood |
Biological Hood |
Biological Hood |
COATHOOD1 |
Spin Coat Hood - RESIST ONLY |
Air Control Spin Coat Hood |
For spin coating photoresist and EBL resists ONLY |
COATHOOD2 |
Spin Coat Hood - ANY MATERIAL |
Air Control Spin Coat Hood |
For spin coating materials |
DEVHOOD1 |
Develop Hood |
Air Control Develop Hood |
For photoresist base develop processing |
EVAP1 |
E-Beam Metal Evaporator |
CHA Industries Solution E-Beam |
Deposition of thin metal films |
EVAP2 |
E-beam & Thermal Metal Evaporator |
Kurt Lesker PVD 75 |
E-beam and thermal evaporation of metal films |
FURN2-Tube1 |
High Temperature Anneal N-type doping |
Tempress 6304 4-Stack Furnace |
High Temperature Annealing (750C-1050C) in Nitrogen used for N-type doped substrates |
FURN2-Tube2 |
Dry Oxidation |
Tempress 6304 4-Stack Furnace |
Dry oxidation (950C-1050C) in Oxygen |
FURN2-Tube3 |
Low Temp Anneal and High Temp Anneal for P-type doping |
Tempress 6304 4-Stack Furnace |
Low Temperature Annealing (400C-600C) in Nitrogen or Forming Gas and High Temp Annealing (up to 1050C) in Nitrogen of P-type substrates |
NANO1 |
Film Thickness Measurement |
Nanometrics 210 |
Film thickness measurements up to 50mm |
OVEN2 |
Bake Oven |
Thermo Scientific Lindberg/Blue M General-Purpose Oven |
Annealing, baking and curing up to 260C in air |
OVEN5 |
Vacuum Bake Oven |
Fisher Scientific Isotemp Model 282A |
Vacuum and nitrogen baking and curing |
OVEN6 |
PDMS Oven |
Barnstead/Thermolyne Type 19200 |
Low temperature oven for baking and curing PDMS and similar materials |
PECVD1 |
Plasma Enhanced Chemical Vapor Deposition System |
Advanced Vacuum Vision 310 |
PECVD deposition of Oxide, Nitride, and Oxynitride films |
PHOTO1 |
Mask Aligner |
Suss MicroTec MJB3 |
Photolithographic patterning |
PHOTO2 |
Frontside/Backside Mask Aligner |
Karl Suss MA6/BA6 |
For Topside or Backside photo alignment and exposure |
PROBE2 |
Probe Station |
Cascade EPS150 Triax |
The probe station consists of a manual probe system with 4 independent probe micro-manipulators. It is configured with a parametric analyzer and a LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures. This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films |
PROF2 |
Profilometer |
Bruker Dektak 150 |
Surface profiling and step height measurements |
RIE1 |
Oxide/Nitride/Polymer Reactive Ion Etcher |
Trion Technology Phantom II |
Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries |
RIE2 |
III-V Reactive Ion Etcher |
Trion Technology Minilock II |
Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries |
RIE3 |
Silicon DRIE |
SPTS Pegasus Deep Silicon Etcher |
Deep Silicon Reactive Ion Etching (DRIE) |
RTA1 |
Rapid Thermal Anneal System |
Jipelec JetFirst 100 |
Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2) |
SCOPE1 |
Microscope w/ camera (manual) |
Nikon Eclipse ME600 |
Optical Microscopy |
SCOPE4 |
Nomarski Microsope w/camera |
Zeiss AxioImager |
BF, DF, and Nomarski (DIC) optical microscopy |
SOLVHOOD1 |
Small Solvent Chemical Hood |
Air Control Solvent Hood |
For solvent chemical processing |
SOLVHOOD2 |
Large ADA Solvent Chemical Hood |
Air Control Solvent Hood |
For solvent chemical processing (including ultrasonics) |
SPUT2 |
RF Dielectric Sputter System |
Kurt Lesker PVD 75 |
RF sputter coating of dielectric materials |
SPUT3 |
DC Sputter System |
Kurt Lesker PVD 75 |
DC sputter coating of metals |
THINKY1 |
Thinky PDMS Mixer/Degasser |
Thinky Mixer AR-100 |
Mixing and degassing PDMS |