SMIF consists of an Instrumentation Laboratory for the characterization and analysis of materials, and a Fabrication Laboratory for the fabrication of devices and micro/nano-structures.
Equipment & Procedures
| Code | Equipment | Model | Applications |
|---|---|---|---|
| ACIDHOOD1 | Small Acid Chemical Hood | Air Control Acid Hood | For acid chemical processing |
| ACIDHOOD2 | Large ADA Acid Chemical Hood | Air Control Acid Hood | For acid chemical processing |
| ALDE1 | Plasma-Enhanced Atomic Layer Deposition (PE-ALD) System | Kurt Lesker ALD-150LX | Plasma-Enhanced Atomic Layer Deposition (PE-ALD) |
| ARRAY1 | Liquid Array Printer | Scienion S11 sciFlexarrayer | Liquid Array Printing |
| ASH1 | Plasma Asher | Emitech K-1050X | O2 / Ar plasma ashing of photoresist and other organic materials |
| BIOHOOD1 | Biological Hood | Biological Hood | Biological Hood |
| BIOHOOD2 | Biological Hood | Biological Hood | Biological Hood |
| COATHOOD1 | Spin Coat Hood - RESIST ONLY | Air Control Spin Coat Hood | For spin coating photoresist and EBL resists ONLY |
| COATHOOD2 | Spin Coat Hood - ANY MATERIAL | Air Control Spin Coat Hood | For spin coating materials |
| DEVHOOD1 | Develop Hood | Air Control Develop Hood | For photoresist base develop processing |
| ELL1 | Ellipsometer | Rudolph Auto EL III | Thickness and index of refraction measurements of thin oxide, nitride, and organic films and optical constants of substrates. |
| EVAP1 | E-Beam Metal Evaporator | CHA Industries Solution E-Beam | Deposition of thin metal films |
| EVAP2 | E-beam & Thermal Metal Evaporator | Kurt Lesker PVD 75 | E-beam and thermal evaporation of metal films |
| FURN2-Tube1 | High Temperature Anneal N-type doping | Tempress 6304 4-Stack Furnace | High Temperature Annealing (750C-1050C) in Nitrogen used for N-type doped substrates |
| FURN2-Tube2 | Dry Oxidation | Tempress 6304 4-Stack Furnace | Dry oxidation (950C-1050C) in Oxygen |
| FURN2-Tube3 | Low Temp Anneal and High Temp Anneal for P-type doping | Tempress 6304 4-Stack Furnace | Low Temperature Annealing (400C-600C) in Nitrogen or Forming Gas and High Temp Annealing (up to 1050C) in Nitrogen of P-type substrates |
| NANO1 | Film Thickness Measurement | Nanometrics 210 | Film thickness measurements up to 50mm |
| OVEN2 | Bake Oven | Thermo Scientific Lindberg/Blue M General-Purpose Oven | Annealing, baking and curing up to 260C in air |
| OVEN5 | Vacuum Bake Oven | Fisher Scientific Isotemp Model 282A | Vacuum and nitrogen baking and curing |
| OVEN6 | PDMS Oven | Barnstead/Thermolyne Type 19200 | Low temperature oven for baking and curing PDMS and similar materials |
| PECVD1 | Plasma Enhanced Chemical Vapor Deposition System | Advanced Vacuum Vision 310 | PECVD deposition of Oxide, Nitride, and Oxynitride films |
| PHOTO1 | Mask Aligner | Suss MicroTec MJB3 | Photolithographic patterning |
| PHOTO2 | Frontside/Backside Mask Aligner | Karl Suss MA6/BA6 | For Topside or Backside photo alignment and exposure |
| PROBE2 | Probe Station | Cascade EPS150 Triax | The probe station consists of a manual probe system with 4 independent probe micro-manipulators. It is configured with a parametric analyzer and a LCR meter for measuring current, voltage, resistance, capacitance, and conductance of devices and structures. This system also includes a 4 point resistivity probing system for making sheet-resistance and resistivity measurements of substrates and films |
| PROF2 | Profilometer | Bruker Dektak 150 | Surface profiling and step height measurements |
| RIE1 | Oxide/Nitride/Polymer Reactive Ion Etcher | Trion Technology Phantom II | Reactive Ion Etching (RIE) of oxide, nitride, and polymer films with fluorine and oxygen chemistries |
| RIE2 | III-V Reactive Ion Etcher | Trion Technology Minilock II | Reactive Ion Etching (RIE) of compound III-V semiconductors using chlorine and bromine based chemistries |
| RIE3 | Silicon DRIE | SPTS Pegasus Deep Silicon Etcher | Deep Silicon Reactive Ion Etching (DRIE) |
| RTA1 | Rapid Thermal Anneal System | Jipelec JetFirst 100 | Rapid thermal annealing up to 1000C in air, vacuum, N2, or forming gas (N2/H2) |
| SCOPE1 | Microscope w/ camera (manual) | Nikon Eclipse ME600 | Optical Microscopy |
| SCOPE4 | Nomarski Microsope w/camera | Zeiss AxioImager | BF, DF, and Nomarski (DIC) optical microscopy |
| SOLVHOOD1 | Small Solvent Chemical Hood | Air Control Solvent Hood | For solvent chemical processing |
| SOLVHOOD2 | Large ADA Solvent Chemical Hood | Air Control Solvent Hood | For solvent chemical processing (including ultrasonics) |
| SPUT2 | RF Dielectric Sputter System | Kurt Lesker PVD 75 | RF sputter coating of dielectric materials |
| SPUT3 | DC Sputter System | Kurt Lesker PVD 75 | DC sputter coating of metals |
| THINKY1 | Thinky PDMS Mixer/Degasser | Thinky Mixer AR-100 | Mixing and degassing PDMS |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| EBL1 | E-Beam Lithography System | Elionix ELS-7500 EX E-Beam Lithography System | Electron Beam Lithography and SEM imaging |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| ACIDHOOD3 | Prep/Offline Acid Chemical Hood | Air Control Acid Hood | For acid chemical processing in a non-cleanroom environment |
| CPD1 | Critical Point Dryer | Bal-Tec CPD 030 | Critical Point CO2 Drying of non-biological samples |
| CPD3 | Critical Point Dryer | LADD CPD3 | Critical Point CO2 Drying of Biological Samples |
| EVAP3 | Thermal Evaporator | JEOL IB-29500VED | Thermal Evaporation |
| GLOW1 | PELCO Glow Discharge System | easiGlow 91000 | Designed to make TEM carbon support grids hydrophilic. |
| IMILL1 | Ion Beam Milling System | Leica EM TIC 3x | Uses high-energy argon-ion beam to mill away material, creates smooth surfaces for electron microscopy or atomic force microscopy samples. |
| OVEN1 | High Temperature Bake Oven | Keison Carbolite LHT 6/30 | Annealing, baking and curing up to 600C in an N2 ambient |
| OVEN4 | Low Temperature Oven for Non-Hazardous Materials | VWR 1350U | Low temperature baking of non-hazardous materials up to 100C |
| PARYL1 | Parylene Coater | Cookson Electronics PDS 2010 LABCOTER2 | Accurate deposition of parylene films |
| SAW3 | Dicing Saw | Disco DAD3220 | Programmed dicing of silicon and other substrates |
| SCOPE7 | Stereo Microscope | American Scope SM-4TZ-FRL | Stereo Microscope |
| SOLVHOOD3 | Prep/Offline Solvent Chemical Hood | Air Control Solvent Hood | For solvent chemical processing in a non-cleanroom environment |
| SPUT6 | Sputter Coater | Denton Desk V | Deposition of a gold film |
| VITRO1 | Vitrobot | FEI Mark IV | Vitrifies suspension samples for imaging with the cryo-TEM. |
| VITRO2 | Vitrobot | FEI Mark IV | Vitrifies suspension samples for imaging with the cryo-TEM. |
| VITROHOOD1 | Vitrobot Hood | Air Control | For preparing Cryo-TEM and other TEM samples. |
| WIBO1 | Wire Bonder | West Bond 747677E | Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices. |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| MTOME2 | Ultramicrotome with cryo chamber | Leica Ultracut UC7 with Cryo Chamber | For thin sectioning embedded biological samples for TEM or for thin sectioning frozen samples for AFM or EM. |
| SEM1 | Scanning Electron Microscope | FEI XL30 SEM-FEG | The SEM is a high magnification imaging tool. Resolution is on the order of 2nm |
| SEM2 | Environmental Scanning Electron Microscope | FEI XL30 ESEM | The ESEM is an instrument that can be used to image dry or hydrated samples. |
| SEM3 | Scanning Electron Microscope with EDS Detector | Apreo S by ThermoFisher Scientific (formerly FEI) | The SEM is a high magnification imaging tool |
| SEM4 | Tabletop Scanning Electron Microscope | Hitachi TM3030Plus Tabletop SEM | The SEM is a tabletop high magnification imaging tool with secondary electron and backscattered electron detectors. |
| TEM2 | Transmission Electron Microscope | FEI Tecnai G² Twin | The TEM is a high magnification imaging tool. Resolution is on the order of 0.3nm |
| TEM3 | Cryo Transmission Electron Microscope | ThermoFisher Krios G3i Cryo TEM | Cryo TEM for single particle analysis |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| MICROCT1 | High Resolution X-ray Computed Tomography Scanner | Nikon XTH 225 ST | X-ray Imaging, Non-destructive CT, Quality Assurance, CAD vs. Actual Comparison (GD&T), Non-Destructive Internal Inspection, 3D Digitization, 3D Metrology, Surface Rendering, Morphology, Morphometrics |
| PRINT3D | 3D Printer | FormLabs Form 2 | 3D printing .STL or .OBJ 3D models created from software programs like CAD, or directly from MicroCT data. |
| RECO1 | Reconstruction PC for MicroCT | RECO1 | X-ray CT Reconstruction of Nikon CT Data, Analysis of CT Data, Image Processing, 3D Visualization and Animation, CT Segmentation, CAD vs. Actual Comparison, Volume Rendering, Morphometric Data Collection, Quality Assurance, Graphics Work |
| RECO2 | Reconstruction PC for MicroCT | RECO2 | X-ray CT Reconstruction of Nikon CT Data, Quick Analysis of CT Data, Image Processing, Quick Volume Rendering |
| RECO3 | Analysis PC for MicroCT | Velocity S58SQ - Quadro M6000 | Analysis of CT Data, Image Processing, 3D Visualization and Animation, CT Segmentation, CAD vs. Actual Comparison, Volume Rendering, Morphometric Data Collection, Quality Assurance, Graphics Work |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| XDIF1 | X-Ray Diffractometer | Panalytical X’Pert PRO MRD HR XRD System | The X-Ray diffraction system can be used for characterizing structural properties of a wide range of materials |
| XPS1 | X-Ray Photoelectron Spectrometer | Kratos Analytical Axis Ultra | XPS is a technique for the detection of variations in chemical composition and oxidation state. The AXIS Ultra provides a high energy resolution capability for both conductive and insulating samples. |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| OPT2 | FT-IR Spectrometer | Thermo Electron Nicolet 8700 | Optical characterization of samples over Infra-Red wavelengths |
| OPT3 | RAMAN/PL | Horiba Jobin Yvon LabRam ARAMIS | Raman and PL spectroscopy |
| OPT4 | UV-Vis-NIR Spectrophotometer with Integrating Sphere | Shimadzu UV-3600i | Optical characterization of samples over UV-Vis-NIR wavelengths |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| AFM2 | Atomic Force Microscope | Asylum Cypher Atomic Force Microscope | Asylum Cypher ES Environmental atomic force microscope. This AFM allows for temperature control and fluid or gas perfusion. It also has blueDrive photothermal excitation, which, by directly exciting the cantilever photothermally, provides significant ease of use and performance benefits for imaging topography, mechanical, electrical, and magnetic properties in air and liquids. |
| Code | Equipment | Model | Applications |
|---|---|---|---|
| AFM1 | Scanning Probe Microscope | Digital Instruments Dimension 3100 | The scanning probe microscope (SPM) produces high resolution, three dimensional images by scanning a sharp tip over the sample surface |
| MSA1 | Micro-Strain Analyzer | TA Instruments RSA III | Mechanical analysis (stress/strain, etc) of materials samples such as polymer films, fibers, and elastomers |
| MTOME1 | Ultra Microtome | Ultracut | For thin sectioning embedded biological samples. |
| PLAP1 | Polishing and Lapping Machine | Logitech PM5 | Polishing and Lapping |
| SAXS2 | Small Angle X-Ray Scattering - Point Source | SAXSLab Ganesha | Point collimated pinhole system for WAXS, MAXS, SAXS and Extreme SAXS of nano-particles for shape & structure analysis; GI-SAXS & GI-WAXS of surfaces for typography |
| SCOPE3 | Fluorescence Microscope w/camera | Zeiss AxioImager | Fluorescence and Optical Microscopy |
| ZYGO1 | 3D Optical Profiler | Zygo NewView 5000 | The 3-D Optical Profiler uses interferometry for imaging and quantifying topographical features such as step heights, critical dimensions, curvature, and roughness. |