RSA-G2 Dynamic Mechanical Analyzer

TA Instruments RSA-G2 Solids Analyzer
Soft Materials Lab - B606
Primary Training Contact
Operating Procedures

Dynamic mechanical analysis (DMA) is the technique of applying a stress or strain to a sample and analyzing the response to obtain phase angle and deformation data. This enables a DMA instrument to quantify the elastic (spring-like) versus viscous (fluid-like) components of the sample response which is crucial for reliable and complete viscoelastic property characterization such as Storage Modulus, Loss Modulus, and Tan delta. DMA measures the mechanical properties of materials as a function of time, temperature, and frequency. The use of an oven for heating and liquid nitrogen for cooling, allows the evaluation of the mechanical properties over a wide range of temperatures.

DMA is commonly used to measure glass transition temperatures (Tg) and secondary transitions, orientation caused by processing, cold crystallization, cure optimization, filler effects in composites, and much more. DMA provides an accurate measure of material modulus and product stiffness plus other important mechanical properties such as damping, creep, and stress relaxation. The RSA-G2 is a is a research-grade DMA. The separate motor and transducer technology of the RSA-G2 ensures the purest mechanical data through independent control of deformation and measurement of stress. It is capable of performing the most accurate DMA measurements as well as many additional experiments, including creep and recovery, stress relaxation, stress ramps, strain rate ramps, iso-strain, iso-force, fatigue, multi-wave, arbitrary waveform, and dielectric thermal analysis. It features a force convection oven for precise and accurate temperature control, extensive array of geometries to accommodate the widest range of sample shapes and stiffness, and immersion testing capability. 

  • creep and recovery
  • stress relaxation
  • stress ramps
  • strain rate ramps
  • iso-strain
  • iso-force, fatigue, multi-wave, arbitrary waveform, and dielectric thermal analysis

Minimum Force                                 0.0005 N

Maximum Force                                       35 N

 Force Resolution                              0.00001 N

Dynamic Displacement Range        ±0.00005 to ± 1.5 mm

Displacement Resolution                           1nm

Modulus Range                                  10^3 to 3 X 10^12 Pa

Modulus Precision                                     ±1%

Tan  Sensitivity                                 0.0001

Tan  Resolution                                0.00001

Frequency Range                               2 X 10^-5 to 100 Hz

Temperature Control                           Force Convection Oven

Temperature Range                            -150 to 600 C

Heating Rate                                        0.1 to 60 C/min

Cooling Rate                                        0.1 to 60 C/min

Isothermal Stability                               0.1 C