Plasma Asher

Image
ASH2
Code
ASH2
Model
Glow Research AutoGlow 200
Location
Cleanroom
Primary Training Contact
Applications
  • Organic material removal through microincineration 
  • Photoresist ashing/removal
  • Use of oxygen and/or argon gases for sample preparation or surface treatments
  • PDMS bonding prep
Specifications
  • 300 Watt RF generator
  • Oxygen & Argon process gases 
  • Dry scroll pump (6CFM)
  • Ability to do both Plasma and RIE modes
  • Ability to process samples sizes up to 200mm (8-inch)
  • Positive resist approximate Etch Rate in Plasma Mode at 100W:   23nm/min
  • Positive resist approximate Etch Rate in Plasma Mode at 200W:   56nm/min