Image
Code
RIE3
Model
SPTS Pegasus Deep Silicon Etcher
Location
Cleanroom
Primary Training Contact
Helpful Links
Applications
- DRIE (Deep Reactive Ion Etch) of silicon substrates and samples
Features
- High etch rates
- High selectivity to photresist or oxide masks
- Vertical sidewalls
Specifications
- Processing up to 150mm wafers (samples smaller than 150mm need to be bonded to a 150mm carrier wafer)
- Only the use of a photorsist or SiO2 mask is allowed (no metal masks allowed)