Plasma Enhanced Chemical Vapor Deposition System

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Plasma Enhanced Chemical Vapor Deposition System
Code
PECVD1
Model
Advanced Vacuum Vision 310
Location
Cleanroom
Primary Training Contact
Operating Procedures
Applications
  • Deposition of oxide, nitride and oxynitride films
Features
  • Easy load chamber
  • Variable substrate heating up to 300 C
  • RF and Low Frequency (LF) generators
Specifications
  • SiO2 deposition rate ~350 A/min
  • Si3N4 deposition rate ~100 A/min