Multi-Wavelength Ellipsometer

FS-RT300 / FS-8 (GEN4)
Soft Materials Lab - B606
Primary Training Contact
Operating Procedures

The FS-RT300 combines an FS-8 Multi-Wavelength Ellipsometer with a compact automated mapping stage to provide fast, accurate, and reliable film thickness uniformity measurements acorss a wafer.

  • Ex-situ thin film characterization:
    • Thickness
    • Refraction Index (n)
    • Extinction Coefficient (k)
  • No moving parts in the ellipsometric detector
  • Automated mapping stage
  • Excellent thickness precision, better than 0.0004 nm for many samples (for a 1 second acquisition), even for sub-monolayer film thickness
  • Integrated computer for instrument control and data analysis, with a web browser interface accessible from any modern computer, laptop, or tablet
  • 8 wavelengths of ellipsometric data (370, 450, 525, 595, 660, 735, 850, 950 nm) with LED sources
  • Accurate thickness measurements for most transparent thin films from 0 – 5 µm
  • Typical time for wafer map: 2.5 minutes (49 points on a 300 mm diameter wafer)
  • Typical thickness repeatability: 0.002 nm
  • Integrating focusing probes, standard spot size: 0.8 x 1.9 mm (other spot sizes available)
  • Stage travel: R (linear), 150 mm, resolution: 12 µm Theta (rotation) 360°, resolution: 0.05°
  • Motorized Z-stage for sample auto alignment
  • Contour and 3D plots of measured parameters