Image
Code
SPUT3
Model
Kurt Lesker PVD 75
Location
Cleanroom
Primary Training Contact
Helpful Links
The PVD 75 DC sputter system features a modular design for deposition of a variety of metallic materials. The system has manual controls allowing for a wide range of processing options. A crystal monitor provides the option of measuring film thinkness and depotision rate during the process if desired. Up to 3 separate films can be deposited sequentially.
Applications
- DC sputtering of up to 3 different materials
- Materials currently available:
- Ti (in location 1)
- Cr (in location 2)
- Al (in location 2)
- Au (in location 3)
- Cu (in location 1 or 3)
- Contact SMIF to request other materials
Features
- RF bias of substrate
- Substrate heating
- Subtrate rotation to improve uniformity
- Argon sputter gas
- Touch screen interface
- PID loop pressure control
- D-shape 304 stainless steel chamber
Specifications
- Ability to process up to 150mm samples
- 100W RF sample bias source
- Substrate temperature control up to 350C
- Three 3-inch sputter targets