Image
Code
SPUT2
Model
Kurt Lesker PVD 75
Location
Cleanroom
Primary Training Contact
Helpful Links
The PVD 75 RF sputter system features a modular design for deposition of a variety of dielectric materials. The system has manual controls allowing for a wide range of processing options. An optical monitor provides the option for deposition monitoring of optical films at multiple wavelengths in the VIS or IR spectrums. Up to 3 separate films can be deposited sequentially.
Applications
- RF sputtering of up to 3 different materials
- Materials currently available:
- ITO(in location 1)
- SiO2 (in location 2)
- Si3N4(in location 3)
- Contact SMIF to request other materials
Features
- Optical thickness monitoring at multiple wavelengths in the VIS or IR spectrums
- RF bias of substrate
- Substrate heating
- Subtrate rotation to improve uniformity
- Argon and oxygen gases
- Touch screen interface
- PID loop pressure control
- D-shape 304 stainless steel chamber
Specifications
- Ability to process up to 150mm samples
- 600W RF source with auto-tuning matching network
- 100W RF sample bias source
- Substrate temperature control up to 350C
- Three 3-inch sputter targets