DC Sputter System

Code: 
SPUT3
Model: 
Kurt Lesker PVD 75
Location: 
Cleanroom
Primary Training Contact: 

The PVD 75 DC sputter system features a modular design for deposition of a variety of metallic materials.  The system has manual controls allowing for a wide range of processing options.  A crystal monitor provides the option of measuring film thinkness and depotision rate during the process if desired. Up to 3 separate films can be deposited sequentially.

Applications: 
  • DC sputtering of up to 3 different materials
  • Materials currently available:
    • Ti (in location 1)
    • Cr (in location 2)
    • Al (in location 2)
    • Au (in location 3)
    • Cu (in location 1 or 3)
    • Contact SMIF to request other materials
Features: 
  • RF bias of substrate
  • Substrate heating
  • Subtrate rotation to improve uniformity
  • Argon sputter gas
  • Touch screen interface
  • PID loop pressure control
  • D-shape 304 stainless steel chamber
Specifications: 
  • Ability to process up to 150mm samples
  • 100W RF sample bias source
  • Substrate temperature control up to 350C
  • Three 3-inch sputter targets