Rapid Thermal Anneal System

Code: 
RTA1
Model: 
Jipelec JetFirst 100
Location: 
Cleanroom
Primary Training Contact: 
Operating Procedures: 

The Jipelec JetFirst rapid thermal annealing (RTA) system is a bench top system designed for R&D applications.  The temperature measurement and control system provides accurate and repeatable thermal control across the temperature range.  Annealing can be performed in air, vacuum, N2, or forming gas (N2/H2).

The system is configured to process substrates up to 100mm in diameter.  Smaller substrates and pieces can easily be processed by placing them a silicon wafer.

Applications: 
  • Annealing of silicon and III-V semiconductor substrates
  • Contact alloying
Features: 
  • Cold wall chamber technology
  • Thermocouple temperature control
  • Atmospheric and vacuum process capability
  • Two process gas lines with mass flow controllers providing N2 and N2/H2 process gases
  • PC control which allows full process monitoring and data acquisition
Specifications: 
  • Temperature range: ambient to 1000C
  • Thermocouple control: ambient to 1000C
  • Maximum heat rate: 200C/second