Silicon DRIE

Code: 
RIE3
Model: 
SPTS Pegasus Deep Silicon Etcher
Location: 
Cleanroom
Primary Training Contact: 
Operating Procedures: 
Applications: 
  • DRIE (Deep Reactive Ion Etch) of silicon substrates and samples
Features: 
  • High etch rates
  • High selectivity to photresist or oxide masks
  • Vertical sidewalls
Specifications: 
  • Processing up to 150mm wafers (samples smaller than 150mm need to be bonded to a 150mm carrier wafer)
  • Only the use of a photorsist or SiO2 mask is allowed (no metal masks allowed)