Plasma Enhanced Chemical Vapor Deposition System

Code: 
PECVD1
Model: 
Advanced Vacuum Vision 310
Location: 
Cleanroom
Primary Training Contact: 
Applications: 
  • Deposition of oxide, nitride and oxynitride films
Features: 
  • Easy load chamber
  • Variable substrate heating up to 300 C
  • RF and Low Frequency (LF) generators
Specifications: 
  • SiO2 deposition rate ~350 A/min
  • Si3N4 deposition rate ~100 A/min